1/7 www.asb.co.kr september 2007 plerow tm ALN0892T1 internally matched lna module the plerow tm aln-series is the compactly designed surface-mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite communi- cation terminals, catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. specifications cdma gsm parameter unit min typ max min typ max frequency range mhz 824 894 890 960 gain db 35 36 34 35 gain flatness db 0.5 0.6 0.5 0.6 noise figure db 0.8 0.85 0.85 0.9 output ip3 (1) dbm 36 37 36 37 s11 / s22 (2) db -18 / -15 -18 / -15 output p1db dbm 20 21 20 21 switching time (3) sec - - supply current ma 100 120 100 120 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is -40 c to +85 c. 1) oip3 is measured with two tones at an output power of 5 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc others ground outline drawing (unit: mm) s 21 = 36.5 db @ 824 mhz = 35.5 db @ 894 mhz s 21 = 35.5 db @ 890 mhz = 34.5 db @ 960 mhz nf of 0.8~0.85 db over frequency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding considerations. 2. we recommend that the ground via holes be placed on the bottom of all ground pins fo r better rf and thermal performance, as shown in the drawing at the left side. (recommended footprint) a ln0892t1 a sb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area website: www.asb.co.kr e-mail: sales@asb.co.kr tel: (82) 42-528-7223 fax: (82) 42-528-7222 asb inc., 4th fl. venture town bldg., 367-17 goijeong-dong, seo-gu, daejon 302-716, korea more information 2-stage single type features description specifications (in production) typ. @ t = 25 c, v s = 5 v, freq. = 859.925 mhz, z o.sys = 50 ohm
2/7 www.asb.co.kr september 2007 plerow tm ALN0892T1 internally matched lna module s-parameters noise figure oip3 p1db 824 ~ 960 mhz +5 v stability factor (k) typical performance (measured)
3/7 www.asb.co.kr september 2007 plerow tm ALN0892T1 internally matched lna module s-parameters noise figure oip3 p1db stability factor (k) cellular 824 ~ 894 mhz +5 v typical performance (measured)
4/7 www.asb.co.kr september 2007 plerow tm ALN0892T1 internally matched lna module item voltage s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) 4.5 -23.38 -18.33 35.55 0.97 0.727 17.59 30.55 71 4.6 -23.74 -18.07 35.68 0.97 0.752 48.51 32.10 76 4.7 -23.91 -19.06 35.79 0.98 0.759 19.39 33.45 82 4.8 -23.97 -18.03 35.89 0.97 0.769 19.92 35.01 87 4.9 -24.03 -18.12 35.97 0.97 0.787 20.82 36.00 92 5.0 -24.11 -18.25 36.04 0.97 0.801 21.43 37.41 98 5.1 -24.27 -18.37 36.10 0.97 0.807 21.90 38.08 103 5.2 -24.43 -18.62 36.15 0.97 0.823 22.33 38.76 108 5.3 -24.50 -18.78 36.20 0.97 0.826 22.63 39.07 113 5.4 -24.65 -18.98 36.23 0.96 0.838 22.96 39.29 118 5.5 -24.72 -19.19 36.26 0.96 0.842 23.12 39.53 122 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 c -23.07 -16.02 36.55 0.97 0.636 22.00 39.69 95 - 20 c -23.55 -16.76 36.37 0.96 0.667 22.05 39.38 97 0 c -24.07 -17.35 36.19 0.96 0.732 22.06 38.74 98 25 c -24.29 -18.32 35.97 0.97 0.799 21.99 38.53 99 40 c -24.05 -19.05 35.82 0.97 0.852 21.93 37.84 99 60 c -23.89 -19.91 35.61 0.98 0.923 21.88 37.26 99 80 c -23.58 -20.98 35.33 0.98 1.014 21.64 36.36 99 100 c -23.04 -22.01 35.07 0.98 1.089 21.41 35.50 98 rf performance with voltage change rf performance with operating temperature
5/7 www.asb.co.kr september 2007 plerow tm ALN0892T1 internally matched lna module s-parameters noise figure oip3 p1db stability factor (k) gsm 890 ~ 960 mhz +5 v typical performance (measured)
6/7 www.asb.co.kr september 2007 plerow tm ALN0892T1 internally matched lna module item voltage s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) 4.5 -20.20 -17.70 34.68 0.87 0.774 17.50 30.27 71 4.6 -20.30 -17.52 34.80 0.87 0.778 18.43 31.92 76 4.7 -20.31 -17.56 34.91 0.87 0.814 19.26 33.24 82 4.8 -20.34 -17.58 35.00 0.86 0.823 20.13 34.65 87 4.9 -20.38 -17.60 35.09 0.87 0.835 20.90 36.17 92 5.0 -20.43 -17.84 35.16 0.87 0.841 21.41 37.45 98 5.1 -20.49 -18.01 35.22 0.86 0.852 21.96 38.35 103 5.2 -20.58 -18.18 35.28 0.86 0.863 22.38 38.92 108 5.3 -20.61 -18.37 35.30 0.86 0.874 22.66 39.28 113 5.4 -20.69 -18.51 35.34 0.86 0.882 22.90 39.38 118 5.5 -20.77 -18.77 35.35 0.86 0.890 23.13 39.55 122 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 c -19.37 -16.12 35.69 0.86 0.627 22.02 39.57 95 - 20 c -20.05 -16.82 35.50 0.87 0.696 22.03 39.39 97 0 c -20.26 -17.39 35.32 0.88 0.734 22.08 38.96 98 25 c -20.35 -18.12 35.00 0.88 0.843 22.00 38.30 99 40 c -20.37 -18.59 34.93 0.87 0.865 21.87 38.06 99 60 c -20.51 -19.10 34.73 0.86 0.961 21.81 37.24 99 80 c -20.43 -19.95 34.45 0.86 1.037 21.59 36.36 99 100 c -20.37 -20.90 34.18 0.87 1.137 21.37 35.49 98 rf performance with voltage change rf performance with operating temperature
7/7 www.asb.co.kr september 2007 plerow tm ALN0892T1 internally matched lna module 1) the tantal capacitor is optional and for bypa ssing the ac noise introduced from the dc supply. the capacitance value may be determined by customer?s dc supply status. 2) so-called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and bl ocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application frequency. application circuit recommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal capacitor v dc 20~40 sec 260 c 200 c 150 c 60~180 sec ramp-up (3 ? c/sec) ramp-down (6 c/sec) size 25 x 25mm in out +vcc (for aln-at, bt, t series ? 10x10mm)
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